ViDex is a 2D measuring instrument for all SemDex metrology tools. The technology combines a high resolution camera with digital image processing.
It measures lateral distances of dies and wafer down to 3 µm with high accuracy and precision or identifies fiducial marks on wafer or dies.
The measuring instrument records 14 frames per second and 40 in live view, combined with the movement of the wafer stage.
ViDex is usually placed above and underneath the wafer to measure lateral distances on both sides of the wafer either with direct illumination and coaxial light or backside illumination.
Matching measuring instruments can be placed in addition on top and bottom side of the stage to extend the range of applications to be covered by only one SemDex metrology tool.
Typical metrology applications are: critical dimensions on die level, fiducial recognition on die and wafer level, checking of test windows, wafer size and taiko ring dimensioning.