3D Trench / TSV Metrology System

This kind of configuration covers 3D TSV and Trench Metrology for Memory, MEMS and Power applications. The Metrology System is equipped with measuring instruments to evaluate deep trenches and shallow trenches with aspect ratios (depth:width up to 35:1) and complementary instruments to monitor the front side passivation process.

The SemDex Metrology System is using Spectral Coherence Interferometry for diameters/width above 5 µm and depths above 70 µm and Interferometry Microscopy with different magnifications for CDs below 5 µm and depths below 70 µm. The measuring instruments for both technologies come with different numerical apertures to cover a wide range of trench sizes. The Metrology System measures critical dimensions such as trench width, TSV diameters depth and gap.

The measuring instrument StraDex f adds the unique capability to measure thousands of features while still achieving throughputs of up to 60 wph. The passivation process with SiO2 and Si3N4 can be measured with an additional instrument StraDex t which is based on Spectral Reflectometry.

Measuring instruments StraDex f, StraDex a and StraDex t are suitable for this.

Stage: Cartesian