Advanced Packaging Metrology System

This kind of configuration is designed for all variants of wafer level advanced packaging such as fan-out, 3D TSV and reconstituted wafers. The Metrology System is equipped with measuring instruments to check process relevant parameters such as Bow, Warp, Thickness and TTV.

The SemDex Metrology System is using Spectral Coherence Interferometry instruments with different numerical apertures to cover the full range of typical materials, from high reflective polished Si to very rough grinded mold. Wafers with up to 10 mm of warpage can be measured and handled reliably. With an additional StraDex f instrument placed on the bottom side of the stage, the total wafer thickness can be measured for virtually any material stack combination. For most stacks single layer information (e.g. bond wafer, bond line and product wafer) can be obtained individually in one measurement step.

For full process step control an additional handling option for dicing frames is available. This combination of measuring instruments allows wafer thickness control independent of the tape thickness. With this kind of Metrology System you have an ideal control temporary wafer bond processes by delivering precise bond layer thickness measurements to find the root cause for product wafer TTV issues.

Measuring instruments StraDex f, ViDex are suitable for this.

Stage: Cartesian