Reclaim Wafer Metrology System

This kind of configuration covers 200 and 300 mm Reclaim Wafers. The Metrology System is equipped with measuring instruments to evaluate wafer flatness, warp, bow and thickness with a repeatability (1σ) of 15 nm for site flatness. Correlation to legacy capacitive type metrology tools has been shown in multiple studies.

The SemDex Metrology System is using Spectral Coherence Interferometry to measure wafer thickness and topography of polished bare wafer and EPI wafer made of Si, Glass, Sapphire and SiC. The measuring instrument measures up to 775 µm thick Si wafer with 4.000 measure points per second.

The Metrology System calculates global and local flatness parameters such as GBIR, SBIR and SFQR as well as wafer shape parameters Warp and Bow according to SEMI M49. It can also be equipped with sorting functions for increased productivity. It complies with the most stringent contamination requirements.

Measuring instrument StraDex f is suitable for this.

Stage: Rotational