This kind of configuration is designed for monitoring all aspects of the TAIKO grinding process. The Metrology System is for evaluating wafer thickness, bow, warp, roughness and dimensional parameters such as Taiko ring width, height and centricity.
The SemDex Metrology System uses a combination of StraDex f instruments, mounted on the top and bottom side of the wafer chuck to check the wafer geometry even for high doped and/or very rough wafers ready for backside metallization. Wafers as thin as 35 µm, as highly doped as 10xE20 and as rough as 300 nm have been successfully measured on this platform. Additionally placed ViDex cameras provide HD images down to 1 µm resolution to enable wafer alignment for on-product measurements and dimensional TAIKO characterization.
The EFEM is also adapted to handle all forms of TAIKO wafers. This could be on carrier wafers, with tape or with warpage up to 5 mm. The special non-vacuum and low contact area end effector design gives maximum safety for those high-value wafers. A special flipping unit can also be added to the configuration for special backside measurements.