CONTACT
sentronics metrology GmbH
Dudenstr. 27-35
68167 Mannheim
Fon: +49 621 84251-0
Fax: +49 621 84251-200
info@sentronics-metrology.de
Key points
Legal documents
Member of
Applications – TSV Depth
Applications – TSV Depth
Applications – TSV Depth
TSV Depth
Measuring instrument StraDex f is suitable for this.
The measurement instrument evaluates the depth of an open via to verify the depth distribution over a wafer. It generates full wafer maps and calculates the TSV Depth Variation of a wafer.