Applications – TSV Depth
Applications – TSV Depth
Applications – TSV Depth
TSV Depth
Measuring instrument StraDex f is suitable for this.
The measurement instrument evaluates the depth of an open via to verify the depth distribution over a wafer. It generates full wafer maps and calculates the TSV Depth Variation of a wafer.
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sentronics metrology GmbH
Dudenstr. 27-35
68167 Mannheim
Fon: +49 621 84251-0
Fax: +49 621 84251-200
info@sentronics-metrology.de
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