Automation

SemDex metrology tools are designed to handle all kind of wafers. Therefore many wafer handling configurations are required.

The metrology tools can handle thin, framed, taped and bonded wafer.

The diameter of a wafer can range from 100 to 330 mm. And the so-called “bridge tools” are able to handle even up to 3 different wafer sizes.

In many cases vacuum handling is sufficient but sensitive wafer require either edge clamp or exclusive zone handling, close to the wafers edge. A robot with a flip axis can handle both scenarios.

Some applications require high warpage handling. Especially sapphire, taiko, thin and eWLB wafers.

Many robots with dual arms are being applied. If wafers can no longer be handled by 2 end effectors, an end effector exchange system comes to operation.
SMIF, FOUP loader and open cassettes are supported as well as overhead transportation.

Loader for FOUP, SMIF, open cassettes and framed wafers are supported even in mixed configurations.

SemDex metrology tools fulfill all requirements of the SEMI Equipment Communication Standards SECS / GEM.